Electronics Design Services
Electronic Industry is facing the challenges of shrinking product cycles, decreasing margins, and ever-increasing customer expectations, the only way to outshine your competition is to stay ahead of the curve by providing next-generation customer experiences.
Technosoft provides Firmware Development, PCB Layout Design, Mechanical Design, Hardware / Electrical Design, Sustenance Engineering, Regulatory Compliance & Certification, System Engineering Solution, Connectivity Solution, Cloud & Analytics and Application Development, Services covering a wide area in the electronics domain. Technosoft is committed to fulfilling your custom Electronic Design Services needs by providing end to end services of product design.
ELECTRONICS DESIGN SERVICE OFFERINGS
FIRMWARE DEVELOPMENT
- System Architecture
- Design & Development
- RTOS/ OS/ Bare Metal Applications
- Porting & Optimization
- BSP/Device Drivers
- System Integration & Security
HARDWARE & ELECTRICAL DESIGN
- High Speed Digital Circuit Design
- Analog Circuit Design
- Sensor Interfaces
- Lower Power Circuit Design
- Signal Integrity
- Power Integrity isolation
MECHANICAL DESIGN
- Industrial Design
- Sheet Metal, Plastics Design
- FEA, Thermal, Shock, Vibration, Ingress
- Packaging
PCB LAYOUT DESIGN
- Multilayer PCB Layout Design
- DFM, DFT, DFA Analysis
- Thermal Analysis
SUSTENANCE ENGINEERING
- Obsolescence Management
- RoHS Compliance
REGULATORY COMPLIANCE & CERTFICATION
- FCC & IEC Compliance
- CE & UL Certfication
- EMI & EMC Testing
SYSTEM ENGINEERING SOLUTIONS
- Requirement Scoping & Traceability
- FMEA, Risk Management, Proto Build
- DFX, Integration Testing, Pre-Compliance
- Test Jigs & Fixtures, V&V Testing
CONNECTIVITY SOLUTIONS
- Network Enablement (WiFi, Bluetooth, BLE Mesh, ZigBee, DMX, etc.)
- Stack Integration & Porting
- Gateway Implementation/ integration
- Standards/Open Source Support
APPLICATION DEVELOPMENT
- Mobile App Development
- Web App Development
- Web Design & Development
- Custom Engineering Software
CLOUD & ANALYTICS
- MS Azure & AWS IoT deployment
- Turning Data into Insights
- Diagnostics & Alerts
- Augmenting Functionality
Product Development Life Cycle
HW/SW Industrial Design Architecture
Proto & Pilot System Build
Regulatory Support for Market Release
Key Services Snapshot
Product Design
- Hardware Design
- Firmware Development
- Mechanical Design
- Prototype & Testing
- New Product Introduction
VA/VE
- Alternate Component Engineering
- DFx Analysis
- Circuit Redesign
- FW Porting, Device Drivers, GUI, Diagnostics
Test Engineering
- Test Jig Development
- Pre-Compliance Testing
- Verification & Validation
Product Sustenance
- Obsolescence Management
- Software Sustenance
- RoHS Compliance
Scholarship Value:
One winner chosen by the judging panel will be awarded $500 cash scholarship. The student can use the scholarship amount towards any expense which may be related or unrelated to her/his educational pursuit.
Who can apply for this Scholarship:
Any student above the age of 18 years and currently enrolled for any program/course in any School or University across the globe.
How to Apply:
Please submit a 1000 words essay on either one of the below-mentioned topics to apply for the scholarship:
Topic 1: Recent Developments in the field of Internet of Things
Topic 2: Challenges in Embedded System Development
Topic 3: Difference Between Robotics and Artificial Intelligence
Please write the Essay in word document and name the file as ‘Your name_TEScholarship19’
Essay must be written in English language.
Please proofread the essay for spelling mistakes, grammatical errors and facts prior to submission.
Submission Process:
Send an email to marketing@technosofteng.com with the subject line – ‘Application for Scholarship Program 2019’ Please include the following details in your email:
- Full Name
- Passport Size Photograph
- Name of your school or college and course or program in which you are enrolled for the current academic year
- Your complete contact details (including your email ID), where we can reach you if you are awarded the scholarship
#NOTE: Please ensure you attach the essay along with the email.
Judging Criteria:
All the applications will be evaluated by an expert panel comprising of directors of Technosoft Engineering and external industry experts. We will judge the applications on Originality and Creativity. The winner will be chosen on the basis of majority vote of the expert panel.
Important Dates:
- Application period – Applications can be submitted from 12:00 am (GMT) of 1st Jan 2019, up to 11:59 pm (GMT) of 31st December 2019.
- Winner Declaration – We will declare the winner on 15th January 2020 at 11:00 am (GMT)
Scholarship Award Declaration:
The scholarship award winner will be announced, on 15th January 2020 at 11:00 am (GMT) on Technosoft Engineering website. We will also notify the winners personally via the email ID shared by them.
Guidelines
- We will accept only 100% original essay. Any plagiarism will instantly lead to disqualification. The responsibility for content originality lies with the applicant and Technosoft Engineering will not be held responsible for content originality or any consequences thereof.
- Each applicant can make only one submission. More than one application by a single applicant will lead to disqualification.
- Applicants under the age of 18 years will be disqualified.
- Do not include watermark, school affiliation, stamp or any other forms of identification in the essay file.
- All submissions will be the property of Technosoft Engineering, and they will have full right to use them as they deemed fit for marketing or other purposes
- You agree to abide by all the rules and guidelines specified above by applying for this scholarship. The scholarship awarded by the judging panel will be deemed as final.
