Electronic Industry is facing the challenges of shrinking product cycles, decreasing margins, and ever-increasing customer expectations, the only way to outshine your competition is to stay ahead of the curve by providing next-generation customer experiences.
Technosoft provides Firmware Development, PCB Layout Design, Mechanical Design, Hardware / Electrical Design, Sustenance Engineering, Regulatory Compliance & Certification, System Engineering Solution, Connectivity Solution, Cloud & Analytics and Application Development, Services covering a wide area in the electronics domain. Technosoft is committed to fulfilling your custom Electronic Design Services needs by providing end to end services of product design.
ELECTRONICS DESIGN SERVICE OFFERINGS
FIRMWARE DEVELOPMENT
System Architecture
Design & Development
RTOS/ OS/ Bare Metal Applications
Porting & Optimization
BSP/Device Drivers
System Integration & Security
HARDWARE & ELECTRICAL DESIGN
High Speed Digital Circuit Design
Analog Circuit Design
Sensor Interfaces
Lower Power Circuit Design
Signal Integrity
Power Integrity isolation
MECHANICAL DESIGN
Industrial Design
Sheet Metal, Plastics Design
FEA, Thermal, Shock, Vibration, Ingress
Packaging
PCB LAYOUT DESIGN
Multilayer PCB Layout Design
DFM, DFT, DFA Analysis
Thermal Analysis
SUSTENANCE ENGINEERING
Obsolescence Management
RoHS Compliance
REGULATORY COMPLIANCE & CERTFICATION
FCC & IEC Compliance
CE & UL Certfication
EMI & EMC Testing
SYSTEM ENGINEERING SOLUTIONS
Requirement Scoping & Traceability
FMEA, Risk Management, Proto Build
DFX, Integration Testing, Pre-Compliance
Test Jigs & Fixtures, V&V Testing
CONNECTIVITY SOLUTIONS
Network Enablement (WiFi, Bluetooth, BLE Mesh, ZigBee, DMX, etc.)
Stack Integration & Porting
Gateway Implementation/ integration
Standards/Open Source Support
APPLICATION DEVELOPMENT
Mobile App Development
Web App Development
Web Design & Development
Custom Engineering Software
CLOUD & ANALYTICS
MS Azure & AWS IoT deployment
Turning Data into Insights
Diagnostics & Alerts
Augmenting Functionality
Product Development Life Cycle
Concept Design
HW/SW Industrial Design Architecture
PCB Design
Proto PCB Assembly
Enclosure Design
Proto & Pilot System Build
System Integration
Test Development
Regulatory Support for Market Release
Key Services Snapshot
Product Design
Hardware Design
Firmware Development
Mechanical Design
Prototype & Testing
New Product Introduction
VA/VE
Alternate Component Engineering
DFx Analysis
Circuit Redesign
FW Porting, Device Drivers, GUI, Diagnostics
Test Engineering
Test Jig Development
Pre-Compliance Testing
Verification & Validation
Product Sustenance
Obsolescence Management
Software Sustenance
RoHS Compliance
Technosoft Engineering Scholarship Program 2019
Scholarship Value:
One winner chosen by the judging panel will be awarded $500 cash scholarship. The student can use the scholarship amount towards any expense which may be related or unrelated to her/his educational pursuit.
Who can apply for this Scholarship:
Any student above the age of 18 years and currently enrolled for any program/course in any School or University across the globe.
How to Apply:
Please submit a 1000 words essay on either one of the below-mentioned topics to apply for the scholarship:
Topic 1: Recent Developments in the field of Internet of Things
Topic 2: Challenges in Embedded System Development
Topic 3: Difference Between Robotics and Artificial Intelligence
Please write the Essay in word document and name the file as ‘Your name_TEScholarship19’
Essay must be written in English language.
Please proofread the essay for spelling mistakes, grammatical errors and facts prior to submission.
Submission Process:
Send an email to marketing@technosofteng.com with the subject line – ‘Application for Scholarship Program 2019’ Please include the following details in your email:
Full Name
Passport Size Photograph
Name of your school or college and course or program in which you are enrolled for the current academic year
Your complete contact details (including your email ID), where we can reach you if you are awarded the scholarship
#NOTE: Please ensure you attach the essay along with the email.
Judging Criteria:
All the applications will be evaluated by an expert panel comprising of directors of Technosoft Engineering and external industry experts. We will judge the applications on Originality and Creativity. The winner will be chosen on the basis of majority vote of the expert panel.
Important Dates:
Application period – Applications can be submitted from 12:00 am (GMT) of 1st Jan 2019, up to 11:59 pm (GMT) of 31st December 2019.
Winner Declaration – We will declare the winner on 15th January 2020 at 11:00 am (GMT)
Scholarship Award Declaration:
The scholarship award winner will be announced, on 15th January 2020 at 11:00 am (GMT) on Technosoft Engineering website. We will also notify the winners personally via the email ID shared by them.
Guidelines
We will accept only 100% original essay. Any plagiarism will instantly lead to disqualification. The responsibility for content originality lies with the applicant and Technosoft Engineering will not be held responsible for content originality or any consequences thereof.
Each applicant can make only one submission. More than one application by a single applicant will lead to disqualification.
Applicants under the age of 18 years will be disqualified.
Do not include watermark, school affiliation, stamp or any other forms of identification in the essay file.
All submissions will be the property of Technosoft Engineering, and they will have full right to use them as they deemed fit for marketing or other purposes
You agree to abide by all the rules and guidelines specified above by applying for this scholarship. The scholarship awarded by the judging panel will be deemed as final.
