Technosoft Engineering is excited to showcase our innovative packaging and engineering solutions at PACK EXPO INTERNATIONAL IN CHICAGO, FROM NOVEMBER 3-6, 2024.
We’d love to connect with you at BOOTH #LL-9209 and discuss how our cutting-edge services can help your business thrive.
Interested in a one-on-one meeting?
Simply fill out the form below, and schedule a meeting with us at the PackExpo24.
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